Film Thickness Measurement Other Metrology

Film Thickness Measurement

ALERIS CX / HX

ALERIS is next generation optical metrology measurement tool. ALERIS incorporates an enhance pattern recognition to accelerate & facilitate recipe generation & setup for multiple chip designs into production. ALERIS integrates advanced optical metrology techniques to handle the full range (150nm to 900nm) of thin film measurement challenges created by new interconnect technologies, increasing device density and advanced gate structures .

SPECIFICATIONS

MODEL	ALERIS CX	ALERIS HX
Maker	KLA-Tencor
Wafer sizes	BBSE (Broad Band SE), WLR (White Light Reflectometer), AMS (low magnification PR), UVR (UltraViolet Reflectometer), SWE, iDesorber, Adv Stress.
Illumination sources	Broadband Xenon Arc Lamp Deuterium Lamp (optional) HeNe Laser (SWE option)
Objectives	Automatic, 3-position turret : 1X, 4X, 15X
Beam Spot	DBS : 40, 10, 2.7 um SE : Measure within a 50 um well
Focus	Automatic focus on measurement site
Computer	Pemtium IV 2.8GHz Computer 160GB IDE hard drive